2.5D packaging: what it means.
In a common 2.5D arrangement, separate dies sit beside one another on an interposer. Dense connections link their functions within the package. Samsung describes arrangements that combine logic with high-bandwidth memory in this way. (Samsung: heterogeneous integration)
An HBM stack can contain vertically stacked memory dies while sitting beside logic in a package described as 2.5D. The labels refer to different levels of the assembly, so the presence of a stack does not automatically make every surrounding connection a 3D logic stack. (Samsung: heterogeneous integration)
Put the definition to work.
An accelerator package can place logic next to HBM stacks. The package can be described as 2.5D even though the memory itself contains vertically stacked dies. (Samsung: heterogeneous integration)
Questions to ask next.
Use these questions as a reading checklist, not as a device-selection recommendation. Exact manufacturer documentation takes priority over a general definition.
- Which dies sit side by side
- Interposer and connection technology
- Die-level versus package-level descriptions
For the broader explanation, explore chiplets and package integration. This page defines the term; the companion guide connects it to the rest of the system.
Common 2.5D packaging questions.
Does every 2.5D package use exactly the same interposer?
No universal construction follows from the label. Examine the materials, interconnect technology and die arrangement described for the actual package. (Samsung: heterogeneous integration)