Interposer: what it means.
An interposer is an intermediate structure used to route connections between dies and the surrounding package. Samsung describes silicon interposers in 2.5D arrangements that place logic and memory side by side. (Samsung: heterogeneous integration)
Do not confuse the interposer with the active logic die or the circuit board outside the package. Each belongs to a different level of the system. Materials and construction must be checked for the actual packaging approach. (Samsung: heterogeneous integration)
Put the definition to work.
In a 2.5D example, logic and HBM can sit side by side on a silicon interposer. Not every multi-die package uses that exact arrangement. (Samsung: heterogeneous integration)
Questions to ask next.
Use these questions as a reading checklist, not as a device-selection recommendation. Exact manufacturer documentation takes priority over a general definition.
- Routing role and material
- Die arrangement and interfaces
- Package-level versus board-level connections
For the broader explanation, explore chiplets and package integration. This page defines the term; the companion guide connects it to the rest of the system.
Common Interposer questions.
Must every multi-die package contain a silicon interposer?
No. A particular example does not define every package architecture. Identify the routing structure in the manufacturer’s package description. (Samsung: heterogeneous integration)