Surface-mount: what it means.
Surface-mount components use pins or pads that meet solder pads on a PCB. The soldered joint provides an electrical and mechanical connection. The term describes an assembly approach rather than a particular semiconductor function. (DigiKey: mounting and package terminology)
Through-hole assembly instead uses leads passing through holes in the board. A design can use both approaches. Select the footprint and assembly requirements from the actual component package. (DigiKey: mounting and package terminology)
Put the definition to work.
SOIC, QFP, QFN, and BGA are different surface-mount package styles. The mounting method alone does not tell you the device’s function or assembly requirements.
Questions to ask next.
Use these questions as a reading checklist, not as a device-selection recommendation. Exact manufacturer documentation takes priority over a general definition.
- Manufacturer-recommended footprint
- Orientation and assembly process
- Package handling and rework requirements
For the broader explanation, explore the complete integrated circuits guide. This page defines the term; the companion guide connects it to the rest of the system.
Common Surface-mount questions.
Does surface-mount mean that the part has no leads?
No. The category includes packages with projecting leads as well as packages with other contact arrangements. The important distinction is connection to surface pads rather than inserted through-hole leads. (DigiKey: mounting and package terminology)