BGA: what it means.
A ball grid array places an array of connection balls beneath the component body. It is one of several surface-mount package families. The underside arrangement makes the package designation distinct from leaded packages whose connections extend visibly from their edges. (Texas Instruments: packaging terminology)
Do not treat the letters BGA as a complete footprint. Ball arrangement, pitch, body dimensions and package identifiers must come from the actual drawing. The same package family can contain devices with very different circuit functions. (Texas Instruments: packaging terminology)
Put the definition to work.
A BGA and a leaded package can contain devices with similar functions while requiring entirely different board footprints. Check the package drawing, not just the family name.
Questions to ask next.
Use these questions as a reading checklist, not as a device-selection recommendation. Exact manufacturer documentation takes priority over a general definition.
- Ball map and orientation
- Pitch and body dimensions
- Exact package drawing and assembly requirements
For the broader explanation, explore the complete integrated circuits guide. This page defines the term; the companion guide connects it to the rest of the system.
Common BGA questions.
Can two BGA parts be substituted because their packages look similar?
Package appearance alone is not a compatibility test. Compare the exact ball map, dimensions, electrical functions and manufacturer requirements before assessing a substitution. (Texas Instruments: packaging terminology)