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Glossary / Expanded definition

Die-to-die interconnect

D2D · links within a multi-die package

A die-to-die interconnect carries signals between semiconductor dies within a package. The physical connection and communication protocol are both part of making those dies work together. (ASE: UCIe specification)

By · Educational reference

01 / UNDERSTAND THE TERM

Die-to-die interconnect: what it means.

A multi-die system needs electrical pathways and agreed communication behavior between its dies. Physical interconnect and protocol requirements both contribute to that communication. UCIe is one specification aimed at this package-level role. (ASE: UCIe specification)

A mechanical connection alone does not establish that two dies can communicate. A specification describes more than where contacts sit, and an actual implementation must be checked against its interface and system requirements. (ASE: UCIe specification)

02 / PRACTICAL CONTEXT

Put the definition to work.

Do not confuse an internal die-to-die link with a board-level connector. Check the interface specification and packaging requirements for the particular design. (ASE: UCIe specification)

03 / READING DOCUMENTATION

Questions to ask next.

Use these questions as a reading checklist, not as a device-selection recommendation. Exact manufacturer documentation takes priority over a general definition.

  • Physical interface and protocol
  • Supported specification and implementation
  • Packaging and integration requirements

For the broader explanation, explore chiplets and package integration. This page defines the term; the companion guide connects it to the rest of the system.

04 / QUICK ANSWERS

Common Die-to-die interconnect questions.

Does die-to-die always mean UCIe?

No. Die-to-die describes the communication role. UCIe is a named specification for that role, not a replacement name for every internal link. (ASE: UCIe specification)

Keep learning

Related definitions.

Compare the processing, memory and packaging roles without confusing them.

For information purposes, not component specifications. Read our editorial standards.